A potentiostat is an electronic device that is used in various electrochemical studies. Electrochemistry is the study of electricity and its relationship with chemical reactions. Electrochemical studies like cyclic voltammetry, square wave voltammetry, and other amperometric studies are carried out on a potentiostat. In voltammetry, potentiostat controls an electrochemical cell where the applied potential is varied and corresponding current readings are found which are related to chemical reactions. These findings help to study electrochemical behavior and study redox reactions occurring at the surface of the electrode. A conventional potentiostat is sophisticated equipment and also priced high. The low-cost portable potentiostat can be designed using a microcontroller and operational amplifiers. STM32 Nucleo-144 board has been used in the construction of potentiostat, it is a 32-bit microcontroller that uses ARM architecture for its operation. It has a 12-bit wide Digital to Analog Converter (DAC) and Analog to Digital Converter (ADC). The principles of DAC and ADC along with the functions of operational amplifiers like summing amplification and current to voltage conversion can be utilized in the design of potentiostat. A varying potential is applied to the working electrode and the current changes in the counter electrode are recorded. STM32 is used because of its high operating speed and wide resolution. The obtained results were found to be on par with the conventional type. Low cost, portability, and usability are advantages of the microcontroller-based potentiostat.

Various packages being used for electronic card assemblies and flat pin as well as dual inline packages are mostly employed. The package pins are coated with nickel followed by gold layer and thicknesses ranging from 1-3 um. The coating not only prevents corrosion due to environmental effect but also takes care of scratches. As the coating thickness is less so the storage conditions plays an important role in keeping the packages intact. Due to improper storage or handling, various contaminants can deposit and stuck due to humidity resulting it in stain which in result may affect long term reliability of packages. The stain can be due to volatile or organic contaminants and needs to be cleaned so as to utilize the component for high reliability applications. Traditionally the stains are cleaned with Iso-propyl Alcohol (wet method) and abrasive cleaning (dry method) through powder which poses lot of constraints as it is performed manually. Apart from that as packages comes with multiple pins having small pitch and width so extra precaution to be taken so as to avoid Electrostatic discharge (ESD), roughness, breakage. This leads to higher time consumption and sometime multiple abrasion which can be detrimental to device long term reliability. To circumvent the same, microwave plasma technique is introduced which leads to stain removal totally avoiding manual operations.Optimization of the power and time is needed so as to remove the stains completely.  This article details the recipe optimization of the microwave plasma and the detailing various observations using optical microscope.

The FTIR spectra of galvinoxyl charge transfer complexes with organic acceptors, such as TCNQ, TCNE, DDQ, chloranil, and iodine, were examined in the current work. This study was carried out between 400 cm^-1 and 4000 cm^-1, which is the mid-IR range. The existence of hopping conduction in these CT complexes is suggested by a half-power beta density in absorption above 1600 cm^-1. Investigating the nature of the transition below 1600 cm^-1 reveals a 0.02–0.05 eV narrow bandgap. This small bandgap is connected to the CDW or SDW pinning gap. Significant band tailing or additional shrinking brought on by electron-electron interaction can both bridge the bandgap. The CT complexes exhibit electrical paramagnetic behaviour at room temperature. Galvinoxyl can prevent its transition to a diamagnetic state at low temperatures due to charge transfer.

AXI Protocol is an On-Chip Communication Protocol used for communication between different Intellectual Property blocks inside a System-On-Chip. With increasing logic density and a plethora of blocks interacting with each other, it becomes pertinent to not only verify the functional correctness of individual IP’s but also to evaluate the integrity of transactions amongst each other. Simulation-based techniques fail to exhaustively assess all the kinds of transactions possible and primarily focus only on a few critical areas for AXI Protocol Verification. This paper proposes the integration of SystemVerilog Assertions coupled with Coverage model to verify the AXI Transactions from Master to Slave. This would aid in developing Verification Intellectual Property (VIP) helping in developing modular reusable components which can be leveraged across different verifications cycles. This paper demonstrates it empirically harvesting results relevant to building Assertion based verification, calculation of bus utilization factor and Coverage closure for RTL Signoff.

Selecting the proper dielectric material as a substrate is vital in the construction of a Microstrip slot antenna. By choosing the right substrate material, it is possible to overcome the drawbacks of microstrip antennas, such as low efficiency, high Return Loss (S₁₁), and Low Gain. This is because the substrate's permittivity is a crucial factor in regulating the antenna efficiency, radiation pattern and antenna gain. This paper presents various substrates for a slotted compact microstrip antenna. Various substrate variations are used in the current work, which is done for wireless applications. In terms of dielectric constant and loss tangent, the substrate materials have two fundamental characteristics. Coaxial probe feeding is employed in the proposed design. It is explored in detail how different types of dielectric materials affect slotted structures in terms of radiation properties like resonating frequency, Gain, Return loss (S11), Current distribution, Radiation pattern. Here, zero loss tangent dielectric materials have been chosen.

Burden of oil imports, rising pollution, and international commitments to combat global climate change are among key factors motivating India’s recent policies to speed up the transition to e-mobility. This paper reviews on advancements in energy storage materials for electric vehicles. Research is needed on nano-sized materials to improve the performance of energy storage on synthesis, characterization and optimization of novel electrode materials. It highlights drivers, strategies, categorization, and measures for smart batteries towards sustainable development.

The proposed antenna is used at 2.4 GHz.The size of antenna is is 60x60x1.6 mm3.The used substrate is Fr4 having the dielectric constant is 4.4. The size of the patch is 29.8x38.4 mm2.The return loss for the antenna is -46.26dB and the gain is 4.45 dBi. The antenna can be used for longer wave transmission.

This article describes the characterization of Monolithic Microwave Integrated Circuit (MMIC) amplifier die before and after packaging. Die level characterization is performed using RF probe station. MMIC die is packaged in a connectorized aluminium housing for further characterization. Characterization of MMIC die using probe station at microwave frequencies involves utmost handling as both RF & DC measurements are carried out simultaneously. The measurement is performed by incorporation of die capacitors, and proper connections so as to have repeatable performance. Also, calibration aspects to be taken care. Further packaging of the die introduces parasitics mostly at launching and output side for which proper characterization to be carried out. In this article, MMIC Die at C-band is characterized both at die & package level. The result indicates package introduces losses. The packaging effects are simulated in standard software tools. Effects of packaging & assembly techniques on RF performance of the connectorized amplifier module are minimized. Interconnection wire-bond length between die and alumina substrates optimized for minimum loss. Gaps between the MMIC die and substrates & carrier plate and housing are reduced to avoid discontinuities in ground plane. The bare die is biased for 4 V drain voltage to draw 45 mA current. The characterized bare die using RF probe station has a gain of 17 dB, comparable to simulated data sheet specifications. Connectorized module after packaging has a gain of 16 dB. Comparison of the simulated and measured packaging effects with bare die is performed and analysis carried out. The packaging technique implemented in this article are to find out a working die for intended aerospace application. The connectorized amplifier module can be used for aerospace applications after screening tests.

The slot in an antenna on the patch or ground plane makes it more compact and conformal. It can be fed by the resonator, coplanar waveguide (CPW), coaxial, slot line, or microstrip with some modifications, and it would be employed in all areas of wireless communication. A small low profile microstrip antenna with various types of fed configuration is carried out for different applications. The addition of a slot increases the bandwidth of these small antennas, making them more applicable in wideband applications. In this report, we highlight the different feeds used in an antenna for bandwidth improvement in terms of better performance. The effect of the different fed techniques on the characteristics of a microstrip patch antenna is discussed in this study.

Due to several regulations imposed by the National Green Tribunal (NGT) on dangerous emissions from industrial waste, environmentally friendly machining is becoming essential ingredient among industrial sector in a sustainable manner. This machining process is capable of significant reduction in waste by remanufacturing, reuse and recycling. This machining process covers an in-depth overview of these operations and practices which are most environmentally sustainable. In the paper different machining operations with applications of minimal quantity lubrication (MQL) are discussed for different engineering materials. This paper also enlighten on energy conservation during machining with useful data and results obtained under these Environment-friendly sustainable machining operations.